【畢業(yè)設(shè)計論文】溫度測量及顯示仿真


溫度測量及顯示仿真實現(xiàn)
摘  要:近年來隨著計算機在社會領(lǐng)域的滲透，單片機的應(yīng)用正在不斷地走向深入，同時帶動傳統(tǒng)控制檢測日新月異更新。在實時檢測和自動控制的單片機應(yīng)用系統(tǒng)中，單片機往往是作為一個核心部件來使用，僅單片機方面知識是不夠的，還應(yīng)根據(jù)具體硬件結(jié)構(gòu)，以及具體應(yīng)用對象特點的軟件結(jié)合，以作完善。
    本文從硬件和軟件兩方面來講述溫度測量過程，在控制過程中主要應(yīng)用單片機AT89C51、數(shù)字溫度傳感器DS18B20、液晶顯示器LCD1602和存儲器24C04A，而主要是通過DS18B20數(shù)字溫度傳感器采集溫度，以單片機為核心控制部件，并通過存儲器進行存儲、液晶顯示器顯示實時溫度的一種數(shù)字溫度計。軟件方面采用C語言來進行程序設(shè)計，使指令執(zhí)行速度快，節(jié)省存儲空間。為了便于擴展和更改，軟件的設(shè)計采用模塊化結(jié)構(gòu)，使程序設(shè)計的邏輯關(guān)系更加簡潔明了，使硬件在軟件的控制下協(xié)調(diào)運作。
本設(shè)計主要做了如下幾方面的工作：一是確定系統(tǒng)的總體設(shè)計方案，包括其功能設(shè)計、組成與工作原理、設(shè)計說明；二是進行硬件電路設(shè)計，包括硬件電路構(gòu)成及測量原理、溫度傳感器的選擇、單片機的選擇；三是進行了調(diào)試和仿真，包括硬件仿真和軟件仿真。
經(jīng)實驗測試表明，該系統(tǒng)測量精度高、抗干擾能力強，具體一定的參考價值。該系統(tǒng)設(shè)計和布線簡單、結(jié)構(gòu)緊湊、體積小、重量輕、抗干擾能力強、性價比高、擴展方便，在大型倉庫、工廠、智能化建筑等領(lǐng)域的溫度檢測中有廣闊的應(yīng)用前景。
關(guān)鍵詞：溫度測量；數(shù)字溫度傳感器DS18B20；AT89C51單片機；液晶顯示器
 
   The simulation of temperature measuring and showing
Abstract: In recent years,with the computer penetration in the social field, the application of SCM  is to keep at the same time, traditional control testing update on crescent benefits. In real-time detection and automatic control system of single-chip applications, often as a single-chip core component to use only single-chip is not enough knowledge,but also the specific hardware structure and the specific features of application software objects combine to make perfect.
    In this paper, both hardware and software for automatic control of temperature measure on the process,in the control of the main application of the process of  single-chip microcomputer AT89C51、digital temperature sensor DS18B20、LED screen, but mainly through the digital temperature sensor DS18B20 collecting ambient temperature to single-chip microcomputer as the core control components, and through LED screen of a digital thermometer temperature.Software using C language for programming, so that the implementation of Directive speed, to save storage space. In order to facilitate the expansion and changes to the design of modular software structure, so that the logic of the relationship between program design more concise, Hardware software co-operation under the control of it.
    The design made the following main aspects: First, the overall design of the system, including its functional design、design principles、the composition and working principle; second, a sensor hardware circuit design,including hardware and measurement circuit principle、the choice of temperature sensor、SCM  choice; Third, we carried out the testing and simulation, including hardware simulation and software simulation.
    The experimental tests show that this high accuracy, strong anti-interference ability,with a certain reference value. The system design and  layout simple and compact structure, small size, light weight, anti-jamming capability, cost-effective to expand convenience, in large warehouses, factories,construction and other areas of temperature measurement in a wide range of application prospects.
Key Words: temperature measure; digital temperature sensor DS18B20; single-chip microcomputer AT89C51;LED scre
目    錄
1 概述……………………………………………………………………….................1
1.1 課題研究的背景………………………………………………………………..1
1.2 課題研究的意義………………………………………………………………..1
1.3 課題研究的目的………………………………………………………………..2
1.4 課題研究的任務(wù)及要求………………………………………………………..2
2  系統(tǒng)總體設(shè)計方案.....................................................................................................3
   2.1  系統(tǒng)的功能設(shè)計................................................................................................3
   2.2  系統(tǒng)的組成與工作原理....................................................................................3
2.2  系統(tǒng)的設(shè)計說明................................................................................................3
3  系統(tǒng)硬件電路的設(shè)計.................................................................................................4
   3.1  系統(tǒng)硬件電路構(gòu)成及測量原理........................................................................4
        3.1.1 系統(tǒng)硬件電路構(gòu)成.................................................................................4
        3.1.2 系統(tǒng)測量原理.........................................................................................5
   3.2  單片機AT89C51…………………………………………………………........5
        3.2.1  AT89C51的主要性能參數(shù)…………………………………………...5
        3.2.2  功能特性概述………………………………………………………...6
        3.2.3  引腳功能說明………………………………………………………...6
        3.2.4  時鐘振蕩器…………………………………………………………...8
        3.2.5  AT89C51軟件編程模式……………………………………………...8
        3.2.6  單片機最小系統(tǒng)設(shè)計………………………………………………....9
        3.2.7  關(guān)于單片機上拉和阻值選擇的問題..................................................11
   3.3  數(shù)字溫度傳感器DS18B20……………………………………………..........12
        3.3.1  DS18B20技術(shù)性能描述 …………………………………………...12
        3.3.2  數(shù)字溫度傳感器DS18B20的簡單介紹……………………………12
 3.3.3  AT89C51單片機與DS18B20的接口……………………………....16
        3.3.4  DS18B20使用中注意事項……………………………………….....18
   3.4  液晶顯示器LCD1602……………………………………………………......19
        3.4.1  LCD1602簡介……………………………………….........................19
        3.4.2  指令集………………………………..................................................20
        3.4.3  LCD1602使用方法…………………………………………….........24
        3.4.4  LCD1602的典型電路……………………………………………….26 
   3.5  存儲器芯片24C04A………………………………………………………….27
        3.5.1  24C04A的特點……………………………………………………....27
        3.5.2  24C04A的一般說明………………………………………………....28
        3.5.3  24C04A的總線特性………………………………………………....28
4  系統(tǒng)的軟件設(shè)計…………………………………………………………………….31
   4.1  系統(tǒng)的總體設(shè)計思路………………………………………………………...31
   4.2  系統(tǒng)的程序設(shè)計……………………………………………………………...31
       4.2.1  主程序………………………………………………………………....31
       4.2.2  讀出溫度子程序……………………………………………………....31
       4.2.3  溫度轉(zhuǎn)化命令子程序…………………………………………………32
       4.2.4  計算溫度子程序………………………………………………………32
       4.2.5  顯示數(shù)據(jù)刷新子程序 ………………………………………………..33  
5  PROTEUS軟件仿真…………………………………………………………….....33
   5.1  PROTEUS 仿真器與集成開發(fā)環(huán)境KEIL.....................................................33
       5.1.1  PROTEUS 仿真器............................................................................... 33                              
       5.1.2  集成開發(fā)環(huán)境KEIL..............................................................................34
   5.2  繪制溫度測量系統(tǒng)仿真電路圖.......................................................................34
   5.3  實現(xiàn)溫度測量系統(tǒng)的仿真…………………………………………………...35
6  結(jié)束語…………………………………………………………………………........38
參考文獻……………………………………………………………………………......39
致謝……………………………………………………………………………………..40
附錄1：程序清單………………………………………………………………...........41
附錄2：設(shè)計圖紙………………………………………………………………...........48