stm32f103zet6中文手冊(cè).pdf
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stm32f103zet6中文手冊(cè),目錄1介紹............................................................................42 規(guī)格說明覽..................................................52.2 系列之間的全兼容性..........
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目錄
1介紹............................................................................4
2 規(guī)格說明覽..................................................5
2.2 系列之間的全兼容性...................................................................6
2.3 概述...........................................................6
2.3.1 ARM®的Cortex™-M3核心并內(nèi)嵌閃存和SRAM........................6
2.3.2 內(nèi)置閃存存儲(chǔ)器.................................6
2.3.3 CRC(循環(huán)冗余校驗(yàn))計(jì)算單元.................................................................7
2.3.4 內(nèi)置SRAM...........................................................................................7
2.3.5 FSMC(可配置的靜態(tài)存儲(chǔ)器控制器)....................................7
2.3.6 LCD并行接口.........................................7
2.3.7 嵌套的向量式中斷控制器(NVIC).........................7
2.3.8 外部中斷/事件控制器(EXTI).....................7
2.3.9 時(shí)鐘和啟動(dòng)...................................7
2.3.10 自舉模式.........................................8
2.3.11 供電方案..................................8
2.3.12 供電監(jiān)控器..............................................................8
2.3.13 電壓調(diào)壓器............................................8
2.3.14 低功耗模式.........................................8
2.3.15 DMA..................................................9
2.3.16 RTC(實(shí)時(shí)時(shí)鐘)和后備寄存器.............................................9
2.3.17 定時(shí)器和看門狗......................................................9
2.3.18 I2C總線...............................................................10
2.3.19 通用同步/異步收發(fā)器(USART)..............................................10
2.3.20 串行外設(shè)接口(SPI)...........................................................10
2.3.21 I2S(芯片互聯(lián)音頻)接口.........................11
2.3.22 SDIO...............................................11
2.3.23 控制器區(qū)域網(wǎng)絡(luò)(CAN)...................................................11
2.3.24 通用串行總線(USB).............................................11
2.3.25 通用輸入輸出接口(GPIO)........................................11
2.3.26 ADC(模擬/數(shù)字轉(zhuǎn)換器)...................................11
2.3.27 DAC(數(shù)字至模擬信號(hào)轉(zhuǎn)換器)..............................................11
2.3.28 溫度傳感器.................................................12
2.3.29 串行單線JTAG調(diào)試口(SWJ-DP)...........................12
2.3.30 內(nèi)嵌跟蹤模塊(ETM)..................................................12
3 引腳定義..............................................15
4 存儲(chǔ)器映像........................................................28
5 電氣特性......................................................29
5.1 測(cè)試條件.........................................................29
5.1.1 最小和最大數(shù)值..............................................29
5.1.2 典型數(shù)值.........................................................29
5.1.3 典型曲線..............................................................29
5.1.4 負(fù)載電容.............................................................29
5.1.5 引腳輸入電壓.................................................29
5.1.6 供電方案................................................30
5.1.7 電流消耗測(cè)量.....................................30
5.2 絕對(duì)最大額定值.................................................30
5.3 工作條件.................................................32
5.3.1 通用工作條件......................................................32
5.3.2 上電和掉電時(shí)的工作條件............................................32
5.3.3 內(nèi)嵌復(fù)位和電源控制模塊特性...................................32
5.3.4 內(nèi)置的參照電壓.........................................................33
5.3.5 供電電流特性.......................................33
5.3.6 外部時(shí)鐘源特性.............................................40
5.3.7 內(nèi)部時(shí)鐘源特性........................................................44
5.3.8 PLL特性.....................................................45
5.3.9 存儲(chǔ)器特性....................................................45
5.3.10 FSMC特性......................................................45
5.3.11 EMC特性......................................................60
5.3.12 絕對(duì)最大值(電氣敏感性)............................................61
5.3.13 I/O端口特性.........................................................62
5.3.14 NRST引腳特性......................................................64
5.3.15 TIM定時(shí)器特性....................................................65
5.3.16 通信接口.....................................................65
5.3.17 CAN(控制器局域網(wǎng)絡(luò))接口.........................................71
5.3.18 12位ADC特性...................................................72
5.3.19 DAC電氣參數(shù)........................................................75
5.3.20 溫度傳感器特性.....................................
1介紹............................................................................4
2 規(guī)格說明覽..................................................5
2.2 系列之間的全兼容性...................................................................6
2.3 概述...........................................................6
2.3.1 ARM®的Cortex™-M3核心并內(nèi)嵌閃存和SRAM........................6
2.3.2 內(nèi)置閃存存儲(chǔ)器.................................6
2.3.3 CRC(循環(huán)冗余校驗(yàn))計(jì)算單元.................................................................7
2.3.4 內(nèi)置SRAM...........................................................................................7
2.3.5 FSMC(可配置的靜態(tài)存儲(chǔ)器控制器)....................................7
2.3.6 LCD并行接口.........................................7
2.3.7 嵌套的向量式中斷控制器(NVIC).........................7
2.3.8 外部中斷/事件控制器(EXTI).....................7
2.3.9 時(shí)鐘和啟動(dòng)...................................7
2.3.10 自舉模式.........................................8
2.3.11 供電方案..................................8
2.3.12 供電監(jiān)控器..............................................................8
2.3.13 電壓調(diào)壓器............................................8
2.3.14 低功耗模式.........................................8
2.3.15 DMA..................................................9
2.3.16 RTC(實(shí)時(shí)時(shí)鐘)和后備寄存器.............................................9
2.3.17 定時(shí)器和看門狗......................................................9
2.3.18 I2C總線...............................................................10
2.3.19 通用同步/異步收發(fā)器(USART)..............................................10
2.3.20 串行外設(shè)接口(SPI)...........................................................10
2.3.21 I2S(芯片互聯(lián)音頻)接口.........................11
2.3.22 SDIO...............................................11
2.3.23 控制器區(qū)域網(wǎng)絡(luò)(CAN)...................................................11
2.3.24 通用串行總線(USB).............................................11
2.3.25 通用輸入輸出接口(GPIO)........................................11
2.3.26 ADC(模擬/數(shù)字轉(zhuǎn)換器)...................................11
2.3.27 DAC(數(shù)字至模擬信號(hào)轉(zhuǎn)換器)..............................................11
2.3.28 溫度傳感器.................................................12
2.3.29 串行單線JTAG調(diào)試口(SWJ-DP)...........................12
2.3.30 內(nèi)嵌跟蹤模塊(ETM)..................................................12
3 引腳定義..............................................15
4 存儲(chǔ)器映像........................................................28
5 電氣特性......................................................29
5.1 測(cè)試條件.........................................................29
5.1.1 最小和最大數(shù)值..............................................29
5.1.2 典型數(shù)值.........................................................29
5.1.3 典型曲線..............................................................29
5.1.4 負(fù)載電容.............................................................29
5.1.5 引腳輸入電壓.................................................29
5.1.6 供電方案................................................30
5.1.7 電流消耗測(cè)量.....................................30
5.2 絕對(duì)最大額定值.................................................30
5.3 工作條件.................................................32
5.3.1 通用工作條件......................................................32
5.3.2 上電和掉電時(shí)的工作條件............................................32
5.3.3 內(nèi)嵌復(fù)位和電源控制模塊特性...................................32
5.3.4 內(nèi)置的參照電壓.........................................................33
5.3.5 供電電流特性.......................................33
5.3.6 外部時(shí)鐘源特性.............................................40
5.3.7 內(nèi)部時(shí)鐘源特性........................................................44
5.3.8 PLL特性.....................................................45
5.3.9 存儲(chǔ)器特性....................................................45
5.3.10 FSMC特性......................................................45
5.3.11 EMC特性......................................................60
5.3.12 絕對(duì)最大值(電氣敏感性)............................................61
5.3.13 I/O端口特性.........................................................62
5.3.14 NRST引腳特性......................................................64
5.3.15 TIM定時(shí)器特性....................................................65
5.3.16 通信接口.....................................................65
5.3.17 CAN(控制器局域網(wǎng)絡(luò))接口.........................................71
5.3.18 12位ADC特性...................................................72
5.3.19 DAC電氣參數(shù)........................................................75
5.3.20 溫度傳感器特性.....................................
