翻譯共15頁 英翻中
Effect of surface oxide on the melting behavior of lead-free solder nanowires andnanorods
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among variousimportant parameters, melting is the most fundamental property affecting the assembly process. Herewe report that the melting behavior of tin and tin/silver nanowires and nanorods can be signi?cantlyaffected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using aflux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosoldermelting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale tomicroscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of themicroscale solder balls formed on Si substrate was measured by direct electron microscopic imaging.These results provide new insights into micro- and nanoscale phase transition and liquid droplet coales-cence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ballgrid array formation.
無鉛納米釬料已經(jīng)證明了在納米線和納米電子組件的作用。在各種重要參數(shù)中，熔點(diǎn)是影響裝配過程中的最基本特性。在我們的報(bào)告中指出，無鉛釬料的表面氧化可以顯著的影響Sn和Sn-Ag納米線，納米棒的熔融。通過控制納米焊料回流氣氛，使用焊劑以有效去除納米線/納米棒的表面氧化物，以及完成納米焊料的熔化。納米焊料的完全融化會導(dǎo)致納米到微米級焊料球的形成以及奧斯特瓦爾德熟化現(xiàn)象。微尺度的焊錫球的接觸角在Si襯底上形成，可以直接通過電子顯微鏡成像測量。這些結(jié)果為微型、納米相變、液滴聚結(jié)的納米線/納米棒的球體以及相關(guān)的納米組裝和小球網(wǎng)絡(luò)陣列的形成提供了新的見解。