the analysis and solutions of defective packaging cases.doc
約6頁DOC格式手機打開展開
the analysis and solutions of defective packaging cases,abstract: analyze the root cause for the defective cases and further discussed the solution based on the process to ensure the reliability in smt production.key...


內容介紹
此文檔由會員 樂吉吉 發(fā)布
Abstract: Analyze the root cause for the defective cases and further discussed the solution based on the process to ensure the reliability in SMT production.
Key words: Surface mounting technology; Ball grid array packaging; Defect; Solution
Key words: Surface mounting technology; Ball grid array packaging; Defect; Solution