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the analysis and solutions of defective packaging cases.doc

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the analysis and solutions of defective packaging cases,abstract: analyze the root cause for the defective cases and further discussed the solution based on the process to ensure the reliability in smt production.key...
編號:5-508498大小:351.50K
分類: 論文>英語論文

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Abstract: Analyze the root cause for the defective cases and further discussed the solution based on the process to ensure the reliability in SMT production.
Key words: Surface mounting technology; Ball grid array packaging; Defect; Solution

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